Method for encapsulating electronic conductors
AssigneeAT&T IPM Corp.
InventorsPeter F. Lilienthal, II, Ivan Pawlenko, Ching-Ping Wong
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Abstract
Glass particles (14) are mixed within an uncured silicone resin (13). The fluid uncured resin is placed in a portion of a terminal block (11) and cured to form a gel (13') by subjecting it to microwaves in a microwave oven (22). Conductors (25, 26) to be interconnected are next inserted into the cured silicone gel and interconnected. The cured gel containing the glass particles thereafter constitutes a dependable insulator for the conductors, particularly the portions of the conductors that are interconnected.
Claims11
A method for encapsulating electronic conductors comprising the steps of:
- mixing glass particles in an uncured silicone resin;
- curing the silicone resin;
- the cured silicone resin encasing electrical conductors to be electrically insulated;
- the curing step comprising the step of transmitting microwaves into the uncured resin, thereby to heat the resin as is required for cure.
A method for making an electrical insulator comprising the steps of:
- mixing glass particles with an uncured insulative silicone resin, which resin is substantially transparent to microwaves of a predetermined frequency;
- said glass particles having a high dipole moment;
- with said particles being dispersed therein, subjecting the uncured resin to microwave radiation of said predetermined frequency, said radiation causing said glass particles to generate sufficient heat to cure said resin;
- prior to cure, encasing an electronic device with said silicone resin, whereby the electronic device is encapsulated by the cured silicone resin;
- said cured resin being substantially electrically insulative.
Dependencies are inferred from the claim text.