US 5,509,850 A · Polishing apparatus

Abstract

An apparatus has a polishing head for polishing an object such as a semiconductor wafer by using a polishing tape stretched between two guide rollers. The head can be rotated so as to change the angle of contact between the tape and the object and also undergo a reciprocating motion perpendicular to the direction of supply of the tape. For this purpose, the apparatus includes a first plate attached to the head and a second plate supported parallel to each other and in motion-communicating relationship by means of rods which are attached to the first plate and penetrate the second plate. The second plate is attached to the rotary shaft of a direct drive motor for causing oscillatory angular motion. This rotary shaft is tubular and an inner shaft for causing the oscillatory motion passes slidably therethrough.

Claims7

Dependent claims

In combination with a polishing tape, an apparatus for polishing an object with said tape, said apparatus comprising:

a motor having a rotary shaft which is tubular, having an axially extending throughhole therethrough;
an inner shaft slidably disposed inside said throughhole, both ends of said inner shaft protruding from said rotary shaft;
a first plate attached to one end of said inner shaft;
at least two guide rollers supported by said first plate for stretching said tape therebetween;
a second plate attached perpendicularly to said rotary shaft;
reciprocating means for moving said inner shaft reciprocatingly through said rotary shaft along said throughhole;
and
connecting means for connecting said first and second plates such that said first and second plates can move selectively towards or away from each other while remaining parallel to each other.

5 more elements

Dependencies are inferred from the claim text.

Polishing apparatus

Life of this patent

Polishing apparatus

Life of this patent

Abstract

Claims7