Method for securing a hybrid circuit on a printed circuit board
AssigneeSiemens Aktiengesellschaft
InventorHans-Bodo Laue
Life of this patent
Estimating the term…
Abstract
Hybrid circuits are usually secured with contact pins (combs) on printed circuit boards by undergoing a flow solder bath. Further, surface-mountable components are soldered on the printed circuit board in a furnace. Two soldering processes are necessary for this purpose. The method of the invention avoids one of the soldering processes by applying through-contacted bores on the carrier substrate of the hybrid circuit. These through-contacted bores are put in place onto solder surfaces of the printed circuit board having a paste solder and the overall arrangement is soldered in a furnace.
Claims8
A method for fastening a hybrid circuit having a carrier substrate onto a printed circuit board, said carrier substrate having a surface with electrical components disposed thereon, comprising the steps of:
- locating through-contacted bores at slight spaces from one another on said carrier substrate;
- providing solder surfaces on said printed circuit board for electrically contacting said hybrid circuit;
- applying a paste solder onto said solder surfaces of said printed circuit board;
- placing said carrier substrate of said hybrid circuit having said through-contacted bores onto said solder surfaces of said printed circuit board;
- and
- placing said printed circuit board and said hybrid circuit in a furnace for soldering with said paste solder.
Dependencies are inferred from the claim text.