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US 5,509,598 AGranted
Wave soldering apparatus and process
AssigneeThe BOC Group, Inc.
InventorsHarbhajan Nayar, Sean M. Adams, Neeraj Saxena, Bohdan A. Wasiczko
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Abstract
A wave soldering process and apparatus in which a localized low oxygen-containing atmosphere is provided at the point of contact of the solder wave and the substrate to be soldered by bubbling an inert gas through the solder wave.
Claims29
A wave soldering process comprising:
- (a) forming at least one solder wave;
- (b) generating a flow of an effective amount of an inert gas through the solder wave to enable the formation of a low oxygen-containing atmosphere at least in the region immediately above the solder wave without substantially splattering the solder onto a substrate to be soldered;
- and
- (c) passing the substrate to be soldered into contact with the solder wave within said low oxygen-containing atmosphere.
1 more element
A wave soldering apparatus comprising:
- (a) means for forming at least one solder wave;
- (b) at least one injection means for generating a flow of inert gas through the solder wave to enable the formation of a low oxygen-containing atmosphere in the region immediately above the solder wave without substantially splattering the solder onto a substrate to be soldered;
- and
- (c) means for processing the substrate to be soldered into contact with the solder wave within said low oxygen-containing atmosphere.
1 more element
Dependencies are inferred from the claim text.