Apparatus and method for automatic monitoring and control of a soldering process

Abstract

Apparatus and method for soldering a first material to a second material uses a laser and involves applying solder paste over the first material, placing the second material on the solder paste in alignment with the first material to form a sample, and focusing a laser beam onto a predetermined location on the sample to segment the solder paste and form a solder joint between the first material and the second material. During the soldering, optical images of at least one region-of-interest in the solder paste adjacent the solder joint are captured. Formation of the solder joint is monitored by repeatedly calculating pixel value sums in the region-of-interest from the optical images to determine whether the solder paste in the region-of-interest has segmented. Control signals may be generated based on the pixel value sums and used to adjust at least one of the intensity and duration of the laser beam.

Dependencies are inferred from the claim text.