Heat-dissipating device for a central processing unit chip
AssigneeBioli Corporation
InventorYaw-Huey Lai
Life of this patent
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Abstract
A heat-dissipating device for a central processing unit chip includes a plurality of heat-dissipating fins. Each fin has at least one through-hole, a lower edge, and a flange connected perpendicularly to the lower edge. At least one rod member passes through the through-hole of the fins so that the fins can be stacked together and spaced apart from one another by the flanges of the fins, with the lower edges of the fins being co-planar. Two connecting members are connected detachably to the two outermost fins. Two ends of the rod member pass through the connecting members. Each of the connecting members has a clamping portion which clamps onto the lower face of the chip so that the upper face of the chip can abut the lower edges of the fins.
Claims4
A heat-dissipating device for a central processing unit chip, the heat-dissipating device comprising:
- a plurality of heat-dissipating fins, each of said fins having at least one through-hole, a lower edge, and a flange connected perpendicularly to said lower edge;
- at least one rod member passing through said through-hole of said fins so that said fins can be stacked together and spaced apart from one another by said flanges, with said lower edges of said fins being co-planar;
- and
- two connecting members connected detachably and respectively to two outermost fins, two ends of said rod member passing respectively through said connecting members, each of said connecting members having a clamping portion which clamps onto a lower face of said central processing unit chip so that an upper face of said central processing unit chip can abut said lower edges of said fins.
Dependencies are inferred from the claim text.