Method for manufacturing a sheet formed connector for inspection of an integrated circuit
AssigneeNEC Corporation
InventorChikara Yamashita
Life of this patent
Estimating the term…
Abstract
It is the object of the invention to provide a method for manufacturing a sheet formed connector for inspecting an integrated circuit at the state of flip-chip bonding and at low pressure condition. The method for manufacturing comprises the steps of making holes on plastic insulating sheet, which is stuck to the metallic sheet, at a certain interval in both longitudinal and lateral directions, making predetermined patterned portions on the metallic sheet by etching, and melting a solder piece in each hole.
Claims3
A method for manufacturing a sheet formed connector for inspection of an integrated circuit, comprising the steps of:
- sticking a heat-resistant plastic sheet and a metallic sheet together,
- making circular holes on said heat-resistant sheet, which reach an inner surface of said metallic sheet, such that centers of said holes are positioned on lattice points assumed on a surface of said heat-resistant sheet,
- forming patterned portions by eliminating metal on said metallic sheet except areas bounded by two concentric circles and containing peripheries of bottom surfaces of holes,
- forming plated layers on inner surfaces of said holes and said patterned portions respectively,
- fitting rod formed solders of equal diameters and equal thicknesses relative to each other into said centers of said holes respectively, and
- melting said rod formed solders located in said circular holes, thereby to fill up said holes, and solidifying said melted rod formed solders,
- whereby a sheet formed connector is produced.
A method for manufacturing a sheet formed connector for inspection of an integrated circuit, comprising the steps of:
- sticking a heat-resistant plastic sheet and a metallic sheet together,
- making holes on said heat-resistant sheet, which reach an inner surface of said metallic sheet, such that centers of said holes are positioned on lattice points assumed on a surface of said heat-resistant sheet,
- forming patterned portions by eliminating metal on said metallic sheet except areas bounded by two concentric circles and containing peripheries of bottom surfaces of holes,
- forming plated layers on inner surfaces of said holes and said patterned portions respectively,
- sticking an adhesive tape on said plated layer formed on said patterned portion,
- fitting rod formed solders of equal diameters and equal thicknesses relative to each other into said centers of said holes respectively,
- removing said adhesive tape, and
- melting said rod formed solders located in said circular holes, thereby to fill up said holes, and solidifying said melted rod formed solders,
- whereby a sheet formed connector is produced.
A method for manufacturing a sheet formed connector for inspection of an integrated circuit, comprising the steps of:
- sticking a heat-resistant plastic sheet and a metallic sheet together,
- making holes on said heat-resistant sheet, which reach an inner surface of said metallic sheet, such that centers of said holes are positioned on lattice points assumed on a surface of said heat-resistant sheet,
- forming patterned portions by eliminating metal on said metallic sheet except areas surrounding peripheries of bottom surfaces of said holes,
- forming plated layers on inner surfaces of said holes and said patterned portions respectively,
- fitting rod formed solders of equal diameters and equal thicknesses relative to each other into said centers of said holes respectively, and
- melting said rod formed solders located in said circular holes, thereby to fill up said holes, and solidifying said melted rod formed solders,
- whereby a sheet formed connector is produced.
Dependencies are inferred from the claim text.