Rf feedthrough
AssigneeHughes Aircraft Company
InventorDung T. Nguyen
Life of this patent
Estimating the term…
Abstract
The present invention provides an improved rf feedthrough connector having a first section (12) in which a inner conductor (18) is spaced from a co-axial outer conductive shield (16) by a cylindrical insulating dielectric layer (22). A second section (14) has a second inner conductor (28) which is electrically coupled to the first inner conductor (18). A second outer shield (34) is spaced from the second inner conductor by a semi-cylindrical insulating dielectric layer (30). The inner radius (R1) of the first outer shield (16) is different from the inner radius (R3) of the second outer shield (26). Given the properties of the material forming the first and second dielectric layers, (22) and (30), these radii are selected so as to provide a uniform impedance in both the first (12) and second (14) sections of the feedthrough connector (10).
Claims21
A microwave transition feedthrough for electrically connecting a microwave integrated circuit (MIC) microstrip transmission line to another electronic component comprising:
- a first section having:
- a first inner conductor;
- a first surrounding conductive shield, said first shield having a first inner radius;
- and
- a first insulating dielectric layer, said first dielectric layer being substantially cylindrical in shape and disposed intermediate said first inner conductor and said first surrounding conductive shield so as to predeterminately space said first inner conductor from said first shield;
- and
- a second section having:
- a second inner conductor electrically coupled to said first inner conductor;
- a second conductive shield with a substantially semi-cylindrical inner surface, said second shield having a second inner radius that is different from said first inner radius of said first conductive shield;
- and
- a second dielectric layer, said second dielectric layer being substantially semi-cylindrical and disposed so as to space said second inner conductor from said second conductive shield,
- wherein the first inner radius of said first shield and second inner radius of said second shield are selected so that said first section has a first characteristic impedance and said second section has a second characteristic impedance that is substantially equal to the first characteristic impedance of said first section.
A package for a microwave integrated circuit (MIC), said MIC having a microstrip transmission line disposed upon a supporting substrate, comprising:
- a conductive housing having at least one cavity formed therein, said MIC disposed in said cavity, said cavity having at least one wall, said wall having an aperture formed therein;
- a feedthrough connector for electrically connecting said MIC microstrip transmission line to another circuit component through said wall, said feedthrough connector including:
- a first section having:
- a first inner conductor;
- a first surrounding conductive shield, said first shield disposed in said aperture and having a first inner radius and a first outer radius;
- and
- a first insulating dielectric layer, said first dielectric layer being substantially cylindrical in shape and disposed intermediate said first inner conductor and said first shield so as to space said first inner conductor from said first shield;
- and
- a second section disposed in said cavity having:
- a second inner conductor electrically coupled to said first inner conductor;
- a second conductive shield, said second shield having a second inner radius and a second outer radius, said second inner radius being different from said first inner radius of said first conductive shield, and the first outer radius being substantially similar to the second outer radius;
- and
- a second dielectric layer, said second dielectric layer being substantially semi-cylindrical and disposed so as to space said second inner conductor from said second conductive shield,
- wherein the first inner radius of said first conductive shield and the second inner radius of said second conductive shield are selected so that said first section has a first characteristic impedance and said second section has a second characteristic impedance substantially equal to the first characteristic impedance of said first section.
A method for making a microwave transition feedthrough for electrically connecting a microwave integrated circuit (MIC) microstrip transmission line to another electronic component comprising the steps of:
- forming a first section having a first characteristic impedance by:
- providing a first inner conductor;
- providing a first conductive shield having a first inner radius radially surrounding said first inner conductor;
- and
- providing a first dielectric insulating layer between said first inner conductor and said first conductive shield, said first dielectric layer being substantially cylindrical;
- forming a second section having a second characteristic impedance by:
- providing a second inner conductor;
- electrically coupling said second inner conductor to said first inner conductor;
- providing a second surrounding conductive shield having a second inner radius;
- and
- providing a second dielectric layer intermediate said second inner conductor and said second outer shield, said second dielectric layer being substantially semi-cylindrical;
- and
- selecting said first inner radius and said second inner radius to provide said first section with the first characteristic impedance substantially equal to the second characteristic impedance of said second section.
Dependencies are inferred from the claim text.