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US 5,508,560 AGranted
Semiconductor module
AssigneeEupec Europaeische Gesellschaft Fuer Leistungs-Halbletter mbh & Co. KG
InventorsWerner Koehler, Reinhold Spanke
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Abstract
A semiconductor module includes a metal base plate having a plane upper sace and a convex lower surface. An electrically insulating and thermally conductive substrate is material-lockingly connected to the upper surface of the metal base plate. Semiconductor chips are material-lockingly connected to an upper surface of the substrate.
Claims5
A semiconductor module, comprising:
- a metal base plate having an upper surface and a lower surface;
- an electrically insulating and thermally conductive substrate connected to said upper surface of said metal base plate, said substrate having an upper surface;
- and
- semiconductor chips disposed on and connected to said upper surface of said substrate;
- said upper surface of said metal base plate being plane and said lower surface of said metal base plate being convex.
2 more elements
Dependencies are inferred from the claim text.