Power circuit package
AssigneeMotorola, Inc.
InventorsSamuel J. Anderson, Guillermo L. Romero
Life of this patent
Estimating the term…
Abstract
A method for forming a power circuit package (45) having a porous base structure (20) electrically isolated from a first porous die mount (21) and a second porous die mount (22) by a dielectric material (29). The porous base structure (20) is bonded to a second surface of the the dielectric material (29) whereas the first porous die mount (21), and the second porous die mount (22) are bonded to a first surface of the dielectric material (29). Simultaneous with the bonding step, the porous base structure (20), the first porous die mount (21), and the second porous die mount (22) are impregnated with a conductive material. Semiconductor die (32, 33, 34, and 35) are bonded to the impregnated die mounts. The semiconductor die (32, 33, 34, and 35) are then encapsulated by a molding compound.
Claims27
A package structure, comprising:
- a porous base structure;
- a dielectric material on the porous base structure;
- at least one porous mount on the dielectric material;
- and
- an electrically conductive impregnation material filling pores within the porous base structure and the at least one porous mount, wherein the electrically conductive impregnation material bonds the base structure and the at least one porous mount to the dielectric material.
A package for a semiconductor die, comprising a non-metallic porous base structure separated from at least one non-metallic porous mount by an electrically insulating material, wherein the non-metallic porous base structure and the at least one non-metallic porous mount are impregnated with a conductive material, and wherein the conductive material bonds the non-metallic porous base structure and the at least one non-metallic porous mount to the electrically insulating material.
A package for a semiconductor device, comprising:
- a non-metallic porous planar base structure having a major surface;
- a dielectric material having first and second major surfaces, a portion of the second major surface of the dielectric material in contact with a portion of the major surface of the non-metallic porous planar base structure;
- at least one non-metallic porous mount in contact with a portion of the first major surface of the dielectric material;
- and
- a conductive material, the conductive material filling the non-metallic porous planar base structure and the at least one non-metallic porous mount, wherein the conductive material bonds the non-metallic porous planar base structure and the at least one non-metallic porous mount to the dielectric material.
A package structure, comprising:
- a non-metallic porous base structure;
- a dielectric material on the non-metallic porous base structure;
- and
- one of a metal or a metal alloy, wherein the one of a metal or a metal alloy fills pores within the non-metallic porous base structure and bonds the non-metallic porous base structure to the dielectric material.
Dependencies are inferred from the claim text.