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US 5,508,558 AGranted
High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion
AssigneeDigital Equipment Corporation
InventorsWilliam C. Robinette, Jr., Chung W. Ho
Life of this patent
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Abstract
An interconnect structure formed of a flexible, multilayer dielectric material such as polyimide, having a support ring, connection points on the section inside the support ring for connecting one or more semiconductor chips, and connection points outside the support ring for connecting to a circuit board. Alignment templates are disclosed which align the semiconductor chip with the connection points.
Claims17
A structure for connecting a semiconductor device to a circuit board comprising:
- a flexible substrate having a plurality of layers, each layer having electronic circuitry separated from circuitry in adjacent layers by a dielectric material;
- a support structure, supporting the flexible substrate, shaped such that a central portion of the flexible substrate is unsupported and leaving a portion of the flexible substrate unsupported permitting said unsupported peripheral portion of the flexible substrate to deflect downwardly;
- a first pattern of connecting pads, in the central portion of the flexible substrate, for connecting to a second pattern of connecting pads on a semiconductor device, including connecting pads in the central area of a surface of the semiconductor device;
- a third pattern of connecting pads at the unsupported peripheral portion of the flexible substrate for connecting directly to a corresponding pattern of connecting pads on a circuit board.
1 more element
Dependencies are inferred from the claim text.