Mounting arrangement for semiconductor devices
AssigneePlessey Semiconductors Limited
InventorRobert J. Dickenson
Life of this patent
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Abstract
An arrangement for making fatigue-free external connections to a device mounted on a direct copper bonded substrate, in which one or more connector tubes are brazed to respective copper areas on the substrate before the device is mounted on the substrate, and external connections are made by soldering leads or bus bars into the tubes.
Claims5
A mounting arrangement for at least one semiconductor device, comprising:
- a substrate of electrically insulating material having directly bonded thereon a plurality of areas of electrically conductive material;
- at least one electrically conductive connector member in the form of a short length of tube brazed directly to one of said areas of electrically conductive material;
- a semiconductor device mounted on said substrate;
- soldered connecting means interconnecting said semiconductor device and said one of said areas of electrically conductive material;
- and electrical conductor means having one end extending within, and soldered directly to, said length of tube to provide an external electrical connection to said semiconductor device.
A method of making an electrical connection to a generally laminar conductor formed on a substrate of electrically insulating material, on which substrate at least one semiconductor device is to be mounted, comprising the steps of:
- brazing onto said laminar conductor an electrically conductive connector member which takes the form of a short length of tube, one end of which is brazed to said laminar conductor;
- mounting said at least one semiconductor device on said substrate;
- and securing an electrical connection to said conductive connector member.
Dependencies are inferred from the claim text.