US 5,508,232 AGranted

Method of manufacturing a semiconductor device

AssigneeMitsubishi Denki Kabushiki Kaisha

InventorsTetsuya Ueda, Kazunari Michii, Yutaka Koyama, Naoto Ueda

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Abstract

In a method of manufacturing a semiconductor device, overlaid on a first lead frame including a die pad supported by a plurality of die pad suspending leads is a second lead frame having connecting leads wherein the first and second lead frames are disposed on a first molding die such that the die pad and inner lead portions of the inner leads of the second lead frame are accommodated within a first cavity of the first molding die while offset portions of the die pad suspending leads are disposed outside of the first cavity. A second molding die is clamped onto the first molding die to define a resin molding chamber which is then filled with a molten resin to form a package. After removing the package from the first and second molding dies, the offset portions are cut away from the package while cutting the connecting leads to a predetermined length. A semiconductor chip as large as permissible can be embedded within a semiconductor device of a standard size while ensuring high quality and improved reliability of the semiconductor device.

Claims16

Dependent claims

A method of manufacturing a semiconductor device comprising:

a first step of disposing in superposition (i) a first lead frame including a die pad having a semiconductor chip mounted thereon, the die pad being supported by a plurality of die pad suspending leads each having an offset portion, and (ii) a second lead frame having connecting leads extending close to electrodes of said semiconductor chip, and electrically connecting respective inner lead portions of said connecting leads to corresponding electrodes of said semiconductor chip with metal wires;
a second step of disposing said first and second lead frames on a first molding die such that said die pad and said inner lead portions are disposed within a first cavity in said first molding die while said offset portions of said die pad suspending leads are disposed outside of said first cavity and overlaying a second molding die having a second cavity on said first molding die to define a resin molding chamber, part of said first and second lead frames inclusive of said offset portions being clamped between abutting surfaces of said first and second molding dies;
a third step of forming a package by filling the resin molding chamber with a resin;
and
a fourth step of removing said package from said first and second molding dies, cutting off said offset portions exposed outside said package, and cutting said connected leads to a predetermined length.

2 more elements

A method of manufacturing a semiconductor device comprising:

a first step of forming a lead frame including a die pad, die pad suspending leads connected to said die pad and having an offset portion, and connecting leads extending close to said die pad, mounting a semiconductor chip of said die pad, and electrically connecting inner lead portions of said connecting leads to electrodes of said semiconductor chip with metal wires;
a second step of positioning said lead frame on a first molding die such that said die pad and said inner lead portions of said connecting leads are disposed within a first cavity in said first molding die while said offset portions of said die pad suspending leads are disposed outside of the first cavity and overlaying a second molding die having a second cavity on said first molding die to define a resin molding chamber with part of said lead frame, inclusive of said offset portions, being clamped between abutting surfaces of said first and second molding dies;
a third step of forming a package by filling the resin molding chamber with a resin;
and
a fourth step of removing said package from said first and second molding dies, cutting off said offset portions exposed outside said package, and cutting said connected leads to a predetermined length.

2 more elements

Dependencies are inferred from the claim text.