Process for fabricating a device
AssigneeAT&T Corp.
InventorsHoward E. Katz, Gary N. Taylor
Life of this patent
Estimating the term…
Loading patent…
AssigneeAT&T Corp.
InventorsHoward E. Katz, Gary N. Taylor
Estimating the term…
The invention is directed to a process for fabricating an integrated circuit. An imaging layer is deposited on a substrate. The imaging layer is an energy sensitive resist material. The energy sensitive resist material contains moieties that preferentially bind to refractory material. A latent image of a pattern is introduced into the imaging layer by patternwise exposing the imaging layer to energy. The patternwise exposure introduces a selectivity into the resist material that is exploited to bind refractory material preferentially to either the exposed resist material or the unexposed resist material, but not both. The refractory material forms an etch mask over the resist material to which it preferentially binds. This etch mask is then used to transfer a pattern that corresponds to the latent image into the substrate.
A process for fabricating a device comprising:
A process for fabricating a device comprising:
Dependencies are inferred from the claim text.