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AssigneeMitsubishi Sindoh Co., Ltd.
InventorsTakeshi Suzuki, Tadao Sakakibara, Manpei Kuwahara, Takao Fukatami
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A copper based alloy for use as a material for electrical and electronic parts has a chemical composition by weight, of 0.5 to 3% Ni, 0.1 to 0.9% Sn, 0.08 to 0.8% Si, 0.1 to 3 Zn, 0.007 to 0.25% Fe, 0.001 to 0.2% P, 0.001 to 0.2% Mg, 0.0001 to 0.001% C, and if required, further containing 0.001 to 0.3% at least one element of Cr and Zr, and the balance being Cu and inevitable impurities. The obtained copper alloy is excellent in electric conductivity, solder-exfoliation resistance when bent, high-temperature creep strength, and migration resistance, while being superior in hot workability and blankability to the conventional copper based alloy.
A copper based alloy for use as a material for electrical and electronic parts, which is excellent in electric conductivity solder-exfoliation resistance when bent, high-temperature creep strength, and migration resistance, as well as in hot workability and blankability, consisting essentially, by weight percent, of 1.3 to 2.7% Ni, 0.2 to 0.79% Sn, 0.2 to 0.8% Si, 0.4 to 2.0% Zn 0.01 to 0.12% Fe, 0.002 to 0.10% P, 0.001 to 0.10% Mg, 0.0002 to 0.0008% C, and the balance being Cu and inevitable impurities.
A copper based alloy for use as a material for electrical and electronic parts, which is excellent in electric conductivity, solder-exfoliation resistance when bent, high-temperature creep strength, and migration resistance, as well as in hot workability and blankability, consisting essentially, by weight percent, of 1.3 to 2.7% Ni, 0.2 to 0.79% Sn, 0.2 to 0.8% Si, 0.4 to 2.0% Zn, 0.01 to 0.12% Fe, 0.002 to 0.10% P, 0.001 to 0.10% Mg, 0.0002 to 0.0008% C, more than 0.01% and up to 0.2% at least one element selected from the group consisting of Cr and Zr, and the balance being Cu and inevitable impurities.
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