Lead frame taping machine
AssigneeApic Yamada Corporation
InventorFumio Miyajima
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AssigneeApic Yamada Corporation
InventorFumio Miyajima
Estimating the term…
The object of the present invention is to provide a lead frame taping machine, which is capable of waiting the fade at a position away from a lead frame holding section and preventing the punch from shaking when the tape-chip is taped onto the lead frame. The lead frame taping machine of the present invention comprises: a lead frame holding section for holding a lead frame; a die plate for holding a tape to be punched, the die plate being provided away from the lead frame holding section and having a through punch-hole; a punch being provided away from the die plate, the punch being capable of moving to and away from the lead frame holding section through the through punch-hole whereby the punch is capable of punching the tape and pressing a tape-chip, which has punched off from the tape, onto the lead frame; and a driving mechanism for moving the punch. The die plate is capable of moving between a first position which is separate away from the lead frame holding section and a second position which is close thereto, the die plate is moved to the second position when the punch punches off the tape and presses the tape-chip onto the lead frame.
A lead frame taping machine comprising:
A lead frame taping machine comprising:
Dependencies are inferred from the claim text.