Low residue water-based soldering flux and process for soldering with same
AssigneeDelco Electronics Corporation
InventorsSamuel V. Bristol, Eugene H. Hanaway, Delbert R. Walls
Life of this patent
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Abstract
Low residue water-based soldering flux, and process and system for using the same. The flux includes a mixture of succinic, glutaric and adipic acid in water, and optionally a wetting agent. The flux is applied to a surface to be soldered. The flux is dried. The surface is soldered. The flux is applied at an application station, dried at a drying station and soldered at a soldering station.
Claims12
A low ionic residue soldering flux consisting essentially of:
- (a) up to about 10% by weight of the total flux, an essentially non-subliming dibasic acid mixture containing about 15-30% by weight of the total mixture succinic acid, about 40-63% by weight of the total mixture glutaric acid and about 10-30% by weight of the total mixture adipic acid;
- and
- (b) a vehicle that is substantially all water.
A process for heat soldering metal surfaces comprising the steps of:
- (a) applying a flux to a surface to be soldered wherein said flux consists essentially of,
- (i) up to about 10% by weight of the total flux, an essentially non-subliming dibasic acid mixture containing about 15-30% by weight of the total mixture succinic acid, about 40-63% by weight of the total mixture glutaric acid and about 10-30% by weight of the total mixture adipic acid;
- (ii) up to about 0.02% by weight of the total flux of a wetting agent;
- and
- (iii) the balance water;
- (b) drying said flux;
- and
- (c) applying solder to said surface.
A system for heat soldering metal surfaces, comprising:
- (a) a station at which a flux is applied to a surface where soldering is to occur, which flux consists essentially of:
- (i) up to about 10% by weight of the total flux, an essentially non-subliming dibasic acid mixture containing about 15-30% by weight of the total mixture succinic acid, about 40-63% by weight of the total mixture glutaric acid and about 10-30% by weight of the total mixture adipic acid;
- (ii) up to about 0.02% by weight of the total flux of a wetting agent;
- and
- (iii) a water vehicle;
- (b) a station for drying said flux;
- and
- (c) a station for soldering said metal surface.
Dependencies are inferred from the claim text.