Resin molding apparatus for sealing an electronic device

An apparatus for molding resin to seal an electronic part, comprising:

• a stationary mold and a movable mold positioned oppositely to each other;
• a pair of chase blocks (7, 8) which are detachably fitted to the stationary mold and the movable mold, respectively, a pair of outside air excluding members (30, 33) for covering an outer side periphery of said stationary mold and said movable mold at a position where a pot for a resin material supply is provided on said stationary mold and said movable mold, a resin path and a cavity for resin molding, said air excluding members (30, 33) being slidable relative to and along the outer side periphery of the respective stationary and movable mold;
• seal members (32, 35, 36) provided at respective fitting surfaces of said stationary mold (3) and said movable mold (4) and said pair of outside air excluding members and a fitting surface of the pair of outside air excluding members;
• and a vacuum path for communicating an outside air excluded space portion set between said stationary mold and said movable mold and a vacuum source when said pair of outside air excluding members are fitted together;
• wherein one air excluding member of said pair of outside air excluding members (30, 33) is fitting onto or into the other air excluding member and vice versa when said stationary mold and said movable mold are clamped together, and an independent drive (31, 34) for each of said outside air excluding members (30, 33) for individually retracting said outside air excluding members (30, 33) to a position at which said members (30, 33) do not interfere with any movement of intercept said chase blocks relative to said stationary mold and relative to said movable mold.

An apparatus for molding resin to seal an electronic component, comprising a first mold, a second mold arranged movably relative to said first mold and adapted to meet said first mold and form a mold cavity therebetween along a parting plane which said first and second molds are moved together, a molding resin supply pot arranged in at least one of said molds, a resin path connecting said resin supply pot to said mold cavity, a first independently movable mold edge closing member (33) arranged on said first mold (3), a second independently movable mold edge closing member arranged on said second mold and adapted to fittingly contact said first mold edge closing member along a fitting surface when said first and second molds are moved into a sealing position, at least one seal member arranged at said fitting surface and adapted to hermetically seal a vacuum space including said mold cavity, said resin supply pot and said resin path when said first and second mold edge closing members fittingly contact one another, and a vacuum path connecting said vacuum space with an external vacuum port, and further comprising a first independent drive member (34) for driving said first mold edge closing member (33), a second drive member (31) for driving said second mold edge closing member (30), and wherein at least one of said mold edge closing members is arranged to be driven by its respective independent drive member beyond said parting plane from its respective mold of said molds so as to fittingly contact the other of said mold edge closing members before said first and second molds meet when said molds are moved toward one another.