US 5,507,499 A · Method of sealing useful in semiconductor processing apparatus for bridging materials having a thermal expansion differential

Abstract

The present invention pertains to an apparatus and method useful in semiconductor processing. The apparatus and method can be used to provide a seal which enables a first portion of a semiconductor processing chamber to be operated at a first pressure while a second portion of the semiconductor processing chamber is operated at a second, different pressure. The sealing apparatus and method enable processing of a semiconductor substrate under a partial vacuum which renders conductive/convective heat transfer impractical, while at least a portion of the substrate support platform is under a pressure adequate to permit heat transfer using a conductive/convective heat transfer means. The sealing apparatus comprises a thin, metal-comprising layer, typically in the form of a strip or band, brazed to at least two different surfaces within said processing chamber, whereby the first and second portions of the semiconductor processing chamber are pressure isolated from each other. Preferably, the metal-comprising layer exhibits a cross-sectional thickness of less than about 0.039 in. (1 mm). The invention is particularly useful when there is a differential in linear expansion coefficient of at least 3.times.10.sup.-3 in./in./.degree.C., measured at 600.degree. C., between the surfaces to be bridged by the thin, metal-comprising layer.

Claims3

Dependent claims

A method of providing a seal between adjacent surfaces of a semiconductor processing apparatus, which method enables the operation of one portion of a semiconductor processing chamber at one pressure while another portion of said processing chamber is operated at a higher pressure, wherein said seal bridges at least two surfaces which exhibit different linear thermal expansion coefficients and when the operational temperature range of said processing chamber is at least 300.degree. C., said method comprising:

a) providing at least a first and second material surfaces which exhibit a different thermal expansion coefficient;
b) providing a thin, metal-comprising layer of material having a linear coefficient of expansion closer to the lowest linear thermal expansion coefficient material to be bridged;
c) brazing said thin, metal-comprising layer along a first edge to said first material surface by a first bead of brazing material, and brazing said thin, metal-comprising layer along a second edge to said second material surface by a second bead of brazing material, said thin, metal comprising layer sealingly contacting said first and second material surfaces only through said first and second beads, whereby said metal-comprising layer, a brazing material, and said material surfaces to which the metal-comprising layer is brazed act as a sealing apparatus.

Dependencies are inferred from the claim text.

Method of sealing useful in semiconductor processing apparatus for bridging materials having a thermal expansion differential

Life of this patent

Method of sealing useful in semiconductor processing apparatus for bridging materials having a thermal expansion differential

Life of this patent

Abstract

Claims3