Circuit board devices with superconducting bonds and lines
OwnerRichard Jacobsinventor
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Abstract
Circuit board devices are provided based on use of high temperature superconducting ceramic polymers comprising high temperature superconducting ceramic powders distributed in electrically insulative organic polymers which are thermosetting by reaction of a two-part liquid mixture or by catalytic or photoinitiation of a one-part liquid. The ceramic domains transmit their superconductivity across the insulating barriers of organic polymers enabling formation of superconductive lines and superconducting bonds to electronic devices to be adhered to circuit boards, and providing superconducting circuitry.
Claims2
Superconducting bonding agent for connection of circuit board substrates to electronic components, said bonding agent comprising an electrically insulating, thermosetting organic polymer matrix comprising a urethane polymer or acrylic polymer having relatively soft segments interspersed with relatively hard segments for flexibility under changes in environment temperature and resistance to debonding under temperature changes and ceramic superconductive particles distributively disposed substantially noncontiguously therein providing superconductivity through said bonding agent, said ceramic superconducting particles comprising from 40 to 90% by weight of the total weight of said organic polymer and said particles.
Dependencies are inferred from the claim text.