Thermoplastic resin composition and a method of molding the same

A thermoplastic resin composition characterized in that it comprises a thermoplastic resin and 0.1 to 100 parts by weight, per 100 parts by weight of said thermoplastic resin, of an imide compound, said imide compound being at least one member selected from the group consisting of:

• (1) a bisimide represented by the formula ##STR10## wherein R.sup.1 and R.sup.2 are the same or different and each represents an alkyl or alkenyl group having 4 to 22 carbon atoms, a cycloalkyl group having 4 to 6 carbon atoms, a group represented by the formula ##STR11## or a group represented by the formula ##STR12## in which R.sup.3 and R.sup.5 are the same or different and each represents an alkyl group having 1 to 22 carbon atoms, R.sup.4 and R.sup.6 are the same or different and each represents a single bond or an alkylene group having 1 to 2 carbon atoms, a is an integer of 1 to 2 and b is an integer of 0 to 2, and A.sup.1 and A.sup.2 are the same or different and each represents a single bond or a phenylene group;
• (2) a monoimide represented by the formula ##STR13## wherein X and Y are the same or different and each represents a group --NH--A.sup.4 --R.sup.8 or a hydroxyl group, R.sup.7 and R.sup.8 have the same meaning as R.sup.1 in the formula (1) and may be the same or different, and A.sup.3 and A.sup.4 are the same or different and each represents a single bond or a phenylene group, and a metal salt thereof;
• and
• (3) a monoimide represented by the formula ##STR14## wherein R.sup.9 and R.sup.10 are the same or different and each represents an alkyl or alkenyl group having 4 to 22 carbon atoms, and A.sup.5 and A.sup.6 are the same or different and each represents a single bond or a phenylene group, and a metal salt thereof.