Buffing apparatus suitable to buff thin plate work and controlling method for the apparatus
AssigneeFujitsu Limited
InventorsEishirou Kawana, Hitoshi Ogawa, Koichi Ishida, Kazuo Aoki
Life of this patent
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AssigneeFujitsu Limited
InventorsEishirou Kawana, Hitoshi Ogawa, Koichi Ishida, Kazuo Aoki
Estimating the term…
A buffing apparatus which can buff a thin plate work without causing buckling. The buffing apparatus comprises a plurality of buffing rolls removably secured in a predetermined spaced relationship from each other to a shaft which is driven to rotate, a backup roll disposed in parallel to the buffing rolls and extending over the overall length of all of the buffing rolls, and a holding roll disposed at least between each adjacent ones of the buffing rolls. The holding roll is positioned such that the axis thereof is positioned on a straight line interconnecting the center of transverse section of one of the buffing rolls and the center of a transverse section of the backup roll and an outer periphery thereof substantially contacts with a contacting plane of the buffing rolls.
A buffing apparatus, comprising:
A buffing apparatus array, comprising:
A buffing method for buffing a plate work using first and second buffing apparatus, each of said first and second buffing apparatus having a plurality of buffing rolls removably secured in a predetermined spaced relationship to a shaft which is driven to rotate, and a backup roll disposed in parallel to said buffing rolls and extending over an entire length of all of said buffing rolls, said buffing method comprising the steps of:
Dependencies are inferred from the claim text.