High density integrated circuit module with snap-on rail assemblies

An integrated circuit module, comprising:

• a plurality of stacked integrated circuit packages, wherein each said package includes a casing, an integrated circuit die disposed within said casing, and a plurality of electrical interconnect leads extending from said die through said casing;
• and
• a plurality of electrically and thermally conductive rails, each said rails including:
• (a) an upper portion which extends over and is in surface contact with the upper major surface of the uppermost of said integrated circuit packages in said module,
• (b) a central portion connected to said upper portion, said central portion being electrically and thermally connected to selected ones of said electrical interconnect leads,
• (c) a lower portion connected to said central portion, said lower portion extending over the lower major exterior surface of the lowermost of said integrated circuit packages in said module;
• and
• (d) a spring-bias portion to provide a spring bias force in said rails to mount said rails to said module;
• a planar spacer element mounted between said lower rail portion and the lower major exterior surface of the lowermost of said integrated circuit packages, said spacer having a plurality of apertures formed about the periphery thereof, said apertures being adapted to receive and position said rails in said module.

A vertical electrical and thermally conductive rail assembly of the type used to interconnect leads extending from a multi-level integrated circuit module, comprising a plurality of conductive rails, each said rail comprising:

• an upper portion which extends over the top of a multi-level integrated circuit module;
• a central portion which is connected to said upper portion of said rail and has means adapted to be electrically and thermally connected to interconnect leads extending from said multi-level integrated circuit module;
• a lower portion connected to said central portion, wherein said lower portion is adapted to extend beneath said multi-level integrated circuit module and is adapted to be in surface contact with said multi-level integrated circuit module;
• and
• a spring-bias portion between said central portion and said lower portion for providing a spring-bias force on said rail.