Transmission line device using stacked conductive layers
OwnerWang-Chang A. Gu, Richard S. Kommrusch +1inventors
InventorsWang-Chang A. Gu, Richard S. Kommrusch, Rong-Fong Huang
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Abstract
A transmission line device (200) employs a first ground plane (118) that is disposed on a first dielectric substrate (202). A first conductive layer (210) that encloses a first area (213)is disposed on a second dielectric substrate (206), which substrate is positioned substantially adjacent to the first dielectric substrate (202). A second conductive layer (211) that encloses an area corresponding to the first area (213) is disposed on a third dielectric substrate (207), which substrate is positioned substantially adjacent to the second dielectric substrate (206). A coil structure is thereby provided that can be employed in the fabrication of a transmission line device, according to the invention.
Claims2
A transmission line device that includes a plurality of stacked dielectric substrates, comprising:
- a first ground plane disposed on a first of the plurality of stacked dielectric substrates;
- a first non-grounded conductive annulus, having a first end electrically connected to an input port for the transmission line device and a second end, that at least partially encloses a first area on a second of the plurality of stacked dielectric substrates
- a second conductive annulus, electrically connected at a first end to the second end of the first non-grounded conductive layer, that substantially encloses a second area corresponding to the first area on a first major surface of a third of the plurality of stacked dielectric substrates;
- a third conductive annulus disposed on a fourth of the plurality of stacked dielectric substrates, and
- second conductive means for connecting the second conductive annulus to the third conductive annulus;
- wherein a vertically-stacked multiple-turn coil is formed using the first conductive annulus, the second conductive annulus and the third conductive annulus.
A transmission line device that includes a plurality of stacked dielectric substrates, comprising:
- a first ground plane disposed on a first of the plurality of stacked dielectric substrates;
- a first non-grounded conductive annulus, having a first end electrically connected to an input port for the transmission line device and a second end, that at least partially encloses a first area on a second of the plurality of stacked dielectric substrates;
- a second conductive annulus, electrically connected at a first end to the second end of the first non-grounded conductive annulus, that substantially encloses a second area corresponding to the first area on a first major surface of a third of the plurality of stacked dielectric substrates;
- a third conductive annulus disposed on a first major surface of a fourth of the plurality of stacked dielectric substrates:
- conductive means for connecting the second conductive annulus to the third conductive annulus;
- and
- a second ground plane disposed on a second major surface of the fourth dielectric substrate;
- wherein a vertically-stacked multiple-turn coil is formed using the first conductive annulus, the second conductive annulus and the third conductive annulus.
Dependencies are inferred from the claim text.