Semiconductor device and lead frame therefore

A semiconductor device having a package in which a semiconductor chip is sealed, said semiconductor device comprising:

• a base;
• a metallic film formed on a surface of the base, said metallic film having a plurality of separated areas, the semiconductor chip being formed on one of the plurality of separated areas, said semiconductor chip including pads thereupon;
• a sealing layer formed on the metallic film;
• a plurality of leads formed on the sealing layer;
• and
• wires connecting the pads on the semiconductor chip to said plurality of leads and the plurality of separated areas and connecting the plurality of leads to the plurality of separated areas.

A semiconductor device having a package in which a semiconductor chip is sealed, said semiconductor device comprising:

• a stage having a plurality of separated areas, the semiconductor chip being formed on one of the plurality of separated areas, the separated areas being used for a power supply system including ground, and being supported by resin of the package, a back surface of the stage opposite to a surface thereof on which the semiconductor chip is mounted being exposed from the package, the stage comprising an electrically conductive material;
• a plurality of leads extending from the package, said leads being separate from said separated areas;
• and
• wires connecting pads formed on the semiconductor chip to the plurality of leads and the separated areas.