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US 5,496,988 AGranted
Device for soldering components on plates
AssigneeRobert Bosch GmbH
InventorPeter Saile
Life of this patent
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Abstract
The invention relates to a device for soldering components on plates under the influence of a gas, having an at least two-piece housing, wherein a seal is provided between the housing elements. It is proposed to employ a liquid as the sealing means. It is achieved by means of this that the mechanical stresses occurring because of thermal stress can be absorbed immediately, because of which the formation of a leak is prevented in a simple manner.
Claims5
A device for soldering components on plates under the effect of a gas comprising a furnace chamber which is enclosed by an at least two-piece housing, and wherein:
- a first housing element has a reservoir for a sealing means into which a second housing element dips partially;
- the first housing element has a continuous wall area defining the reservoir;
- said sealing means is a liquid;
- said second housing element has a supporting part and a sealing part enclosing said furnace chamber;
- said sealing part encloses said supporting part in the area of said sealing means;
- and the continuous wall area is provided with reinforcing means in the area of the liquid reservoir.
3 more elements
Dependencies are inferred from the claim text.