Circuit arrangement for multilayer printed circuit board

A circuit arrangement for a multilayer printed circuit board, comprising:

• a substrate member;
• a first circuit layer comprising a first dielectric layer formed on said substrate member, said first circuit layer having a circuit pattern formed on said first dielectric layer which includes conductive segments having only an X-directional component;
• a second circuit layer comprising a second dielectric layer formed on said first circuit layer, said second circuit layer having a circuit pattern formed on said second dielectric layer which includes conductive segments having only a Y-directional component perpendicular to said X-directional component;
• and
• electrical connections between said X-directional conductive segments and said Y-directional conductive segments being suitably established by vias provided in said second circuit layer,
• wherein the circuit pattern of said first circuit layer further includes slant conductive segments having both X-directional and Y-directional components and arranged in a blank zone which is not occupied by said X-directional conductive segments, and the circuit pattern of said second circuit layer further includes slant conductive segments having both X-directional and Y-directional components and arranged in a blank zone which is not occupied by said Y-directional conductive segments;
• electrical connections between the slant conductive segments of said first circuit layer and the slant conductive segments of said second circuit layer being suitably established by vias provided in said second circuit layer.