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US 5,496,970 AGranted
Planar cable array
AssigneeW. L. Gore & Associates, Inc.
InventorMark S. Spencer
Life of this patent
Estimating the term…
Abstract
This invention provides a high-density planar contact array capable of interconnecting various electronic devices using a pad to pad approach or pad to pin, which is capable of accommodating non-coplanarity in the Z axis of printed circuit boards but which still maintains good electrical contact. The array comprises an insulative substrate sheet that has a plurality of parallel conductive lines terminating in a pad over a hole in the substrate.
Claims2
A planar cable array for transmitting electrical signals comprising:
- an elongated planar strip of electrical insulating material 10, said strip having a plurality of holes 42 extending through the strip at a section thereof;
- a plurality of parallel electrical conductors 40 affixed to and extending lengthwise along said strip;
- one end of each conductor having a conductive pad attached thereto, said pad of each conductor being disposed and positioned within a corresponding aforesaid hole, whereby each said pad freely floats within said hole in the Z axis direction of said planar strip so as to promote contact with an abutting electrical panel.
Dependencies are inferred from the claim text.