Superconducting microwave parts having a package, two substrates, and line and grounding conductors

A superconducting microwave component comprising:

• a first substrate having a conductor line comprised of an oxide superconductor disposed on a first surface thereof;
• a second substrate having a grounding conductor comprised of an oxide superconductor disposed on a second surface thereof;
• and
• a package comprised of a conducting material housing the first and the second substrates such that the first and second surfaces are substantially parallel, the package including a bottom plate, and a casing having a lower end surface fixed to a peripheral edge portion of the bottom plate and a first stepped face defining in part said inner surface, said first stepped face being proximate the lower end surface whereby a peripheral edge portion of the second substrate is held between the bottom plate and the first stepped face, the grounding conductor being in contact with the bottom plate.

A superconducting microwave component comprising:

• a first substrate comprised of a first dielectric material and having a first surface and a conductor line comprised of an oxide superconductor disposed on the first surface thereof;
• a second substrate comprised of the first dielectric material and having a second surface and a grounding conductor comprised of an oxide superconductor disposed on the second surface thereof;
• and
• a package comprised of a conducting material housing the first and the second substrate such that the first and second surfaces are arranged substantially in parallel, at least a part of the grounding conductor electrically contacting an inner surface of the package by direct surface contact therewith, wherein
• the package comprises a bottom plate, and a casing having a lower end face portion with a lower end face fixed to a peripheral edge portion of the bottom plate and a stepped face defining in part said inner surface;
• and wherein the first substrate is arranged on the second substrate, and wherein a peripheral edge portion of the first substrate and a peripheral portion of the second substrate respectively are held between the bottom plate and the stepped face.

A superconducting microwave component comprising:

• a first substrate comprised of a first dielectric material and having a first surface and a conductor line comprised of an oxide superconductor disposed on the first surface thereof;
• a second substrate comprised of the first dielectric material and having a second surface and a grounding conductor comprised of an oxide superconductor disposed on the second surface thereof;
• and
• a package comprised of a conducting material housing the first and the second substrate such that the first and second surfaces are arranged substantially in parallel, at least one part of the grounding conductor electrically contacting an inner surface of the package by direct surface contact therewith, wherein
• the package comprises a bottom plate and a casing, wherein the first substrate has an area which is smaller than an area of the second substrate, the second substrate is arranged on the bottom plate and the first substrate is arranged on the second substrate, and wherein the package includes a presser member inserted in the casing to be in contact with a peripheral edge portion of the grounding conductor.