Method of arranging alignment marks

A method of arranging alignment marks used in the formation of semiconductor devices on a wafer on scribing lines separating the semiconductor devices being formed, the scribing lines forming cutting lines for cutting and separating the individual semiconductor devices from each other after formation, and the alignment marks having widths greater than the widths of the scribing lines, said method comprising the steps of:

• forming an alignment mark within an area along one of the scribing lines having a width greater than the width of the one of the scribing lines;
• covering a part of the area in which the alignment mark was formed after the alignment mark has been used in the formation of semiconductor devices so that the area is reduced in width toward the width of the one of the scribing lines;
• and
• arranging a new alignment mark within another area along the one of the scribing lines having a width greater than the width of the one of the scribing lines.

A method of arranging alignment marks, comprising the steps of:

• forming a plurality of structures on a semiconductor wafer with scribing lines between said plurality of structures, each of said scribing lines comprising a first area having a first width, a second area having a second width larger than said first width and a third area having a third width larger than said first width, and forming a first alignment mark arranged within said second area;
• covering said second area with a first film such that said second width of said second area becomes nearly said first width of said first area;
• and
• arranging a second alignment mark within said third area.