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AssigneeThe United States of America as represented by the Administrator of the National Aeronautics and Space Administration
InventorsJohn W. Connell, Timothy W. Towell, Stephen S. Tompkins
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Films of thermoplastic poly(arylene ether imidazole)s (PAEI)s are used as surface modifiers for neat resin panels and composite resin panels. The PAEI polymer contains imidazole groups along the backbone which co-cure, i.e., react chemically, with epoxies or bismaleimides during processing and thereby provide excellent adhesion between the PAEI film and an epoxy or bismaleimide neat resin or composite resin facesheet. The film provides good adhesion and a smooth surface to the finished part and acts as a release agent from the mold. The as-processed integral structures have very smooth (specular) surfaces, and since the film releases readily from a glass mold, no release agent is necessary. The PAEI film is thermally stable, resistant to electron radiation, and adheres tenaciously to the facesheet. The film maintains good adhesion even after thermal cycling from room temperature to .about. -196.degree. C.
An integral structure comprising a surfacing film of a thermoplastic poly(arylene ether imidazole) chemically bonded (co-cured) to a member selected from the group consisting of neat epoxy or bismaleimide resin panels and composite epoxy or bismaleimide resin panels wherein the thermoplastic poly(arylene ether imidazole) is prepared by reacting a di(hydroxyphenyl)imidazole and an activated aromatic dihalide or dinitro compound having the general structure:
A parabolic reflector comprising a paraboloidal composite resin panel of carbon fiber/epoxy which is chemically bonded (co-cured) to a surfacing film of a thermoplastic poly(arylene ether imidazole), the exposed surface of the surfacing film having a reflective layer of aluminum vapor deposited thereon, followed by a layer of silicon oxide vapor deposited thereon, and wherein the thermoplastic poly(arylene ether imidazole) is prepared by reacting a di(hydroxyphenyl)imidazole and an activated aromatic dihalide or dinitro compound having the general structure:
Dependencies are inferred from the claim text.