Process for removing fine particles
AssigneeSony Corporation
InventorJunichi Sato
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AssigneeSony Corporation
InventorJunichi Sato
Estimating the term…
A process for detecting fine particles includes the steps of forming a sublimable thin film on an essential surface of a wafer on which fine particles are present, irradiating laser beam at the surface of the wafer, receiving a reflected beam from the surface which is scattered by the presence of the fine particles, and detecting the particles from the received scattered beam. The process may further include the step of accomplishing an etchback against the sublimable film to partially retain the sublimable film adjacent the surface of the fine particles. The film can be prepared from one or a mixture of gases including free sulfur generatable gas under discharge-dissociation conditions. Sulfur compounds or polythiazyl are preferable. Alternatively, the film can be made of a condensed film of organic solvent vapor. The sublimable film is sublimed by heating after the step of detecting the fine particles.
A process for removing fine particles from a wafer surface of a wafer comprising the steps of:
A process for removing fine particles from a wafer surface of a wafer comprising the steps of:
Dependencies are inferred from the claim text.