Method and device for peeling a film

A film peeling method in which two laminated thin films each consisting of a photoresist layer and a light transmissive film are respectively coated on the front and back surfaces of a circuit board, two vibrators each including a rod are respectively disposed above and below the circuit board in such a manner that they surround the circuit board from the front and back surfaces of the circuit board respectively as well as the leading ends of the rods are disposed to face each other with the circuit board between them, the vibratory motions of the rods are applied onto the end portions of the respective laminated thin films coated on the front and back surfaces of the circuit board to thereby float part of the light transmissive films from the associated photoresist layers, and the films are peeled off from the floated portions of the light transmissive films, said method comprising the steps of:

• setting the positions of said front and back rods leading ends with respect to said circuit board so as to offset each other along the surface of said circuit board;
• disposing back and front backup members in such positions as to be respectively opposed to said front rod leading end and said back rod leading end through said circuit board and said laminated thin films;
• and
• moving said back and front backup members along said circuit board and said two laminated thin films respectively in synchronization with said mutually opposing front and back rod leading ends.