Package manufacturing method
AssigneesSankyo Company, Limited, Dai Nippon Printing Co., Ltd.
InventorsHideo Miura, Yoshiaki Watanabe, Mitsuhiro Sumimoto
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AssigneesSankyo Company, Limited, Dai Nippon Printing Co., Ltd.
InventorsHideo Miura, Yoshiaki Watanabe, Mitsuhiro Sumimoto
Estimating the term…
A package is formed of a molded sheet (1) of a thermoplastic synthetic resin having a plurality of pocket-shaped molded portions (2) formed in one surface thereof, with an object (T) to be packaged accommodated in each of the pocket-shaped molded portions; and a sealing sheet is bonded to the other surface of the molded sheet so as to seal off openings of the pocket-shaped molded portions. A deposit layer (4) of an inorganic oxide such as a silicon oxide is formed on one or both of the inner and outer surfaces of each pocket-shaped molded portion (2). The deposit layer (4) compensates for thinning of a top wall (2a) and peripheral edge (2c) of the pocket-shaped molded portion (2), caused by the molding process, to increase the barrier capability thereof.
A method of manufacturing a package, comprising the steps of:
Dependencies are inferred from the claim text.