Process for providing a landless via connection
AssigneeInternational Business Machines Corporation
InventorsRichard W. Carpenter, Robert E. Ruane
Life of this patent
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Abstract
A process for connecting at least two electrically conductive patterns through a dielectric material by a landless electrical connection is provided. The process includes providing a composite containing a dielectric substrate having a conductive plane on at least one of its major surfaces and a temporary support layer covering the conductive plane. Blind vias are provided in the dielectric substrate and are plated with an electrically conductive material. The temporary support layer is removed thereby providing a landless electrical connection through the dielectric material and the conductive plane is available for providing external electrical conductive pattern.
Claims10
A process for connecting at least two electrically conductive patterns through a dielectric material by a landless electrical connection which comprises:
- (a) providing a dielectric substrate having a conductive plane on one of the major surfaces thereof and a temporary support layer covering said conductive plane, where by said conductive plane is located between said dielectric substrate and said temporary support layers;
- (b) providing blind vias in said dielectric substrate;
- (c) plating vias in said dielectric substrate and on said dielectric substrate with an electrically conductive material;
- (d) removing said temporary support layer to thereby provide a landless electrical connection through said dielectric material whereby said conductive plane is available for providing external electrical conductive pattern.
Dependencies are inferred from the claim text.