Method and assembly for mounting an electronic device having an optically erasable surface
AssigneeMotorola, Inc.
InventorsJames A. Zollo, Barbara R. Doutre, Rudy Yorio
Life of this patent
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Abstract
An integrated circuit (106) having an optically erasable portion (114) is joined to a substrate (102) such that the optically erasable portion faces the substrate. The substrate (102) includes an aperture (104) that exposes the optically erasable portion (114) of the integrated circuit providing erasing capability to the integrated circuit (106). A plug (110) impermeable to light may be inserted into the aperture (104) to provide a sealed window to the optically erasable portion (114) of the integrated circuit (106).
Claims7
A method for erasing an integrated circuit having an optically erasable portion, the method comprising the steps of:
- attaching the integrated circuit to a first surface of a printed circuit board having first and second surfaces, such that the optically erasable portion faces the first surface of the printed circuit board;
- providing an opening through the first and second surfaces of the printed circuit board, the opening providing a window to the optically erasable portion of the integrated circuit;
- applying light of a predetermined wavelength through the opening to erase the integrated circuit;
- and
- preventing further erasure by inserting a plug into said opening, said plug sealing the window to said optically erasable portion of the integrated circuit.
Dependencies are inferred from the claim text.