Electronic apparatus having a switching mechanism with a conductive pattern disposed on a substrate side

An electronic apparatus comprising:

• a case having a main surface and a side surface;
• a substrate disposed within the case and having a main surface and a side surface;
• a printed wiring circuit disposed on the main surface of the substrate;
• a first conductive pattern disposed on the side surface of the substrate and connected to the printed wiring circuit;
• a second conductive pattern disposed on the side surface of the substrate and connected to the printed wiring circuit, the second conductive pattern being spaced from the first conductive pattern;
• an elastic member having a conducting element spaced from and facing the side surface of the substrate;
• and an operating member mounted on the side surface of the case and operable when depressed to elastically flex the elastic member to displace the conducting element into contact with the first and second conductive patterns on the side surface of the substrate.

In a timepiece:

• a case having a main surface and a side surface;
• a substrate disposed within the case and having a main surface and a side surface;
• a printed wiring circuit disposed on the main surface of the substrate;
• a first conductive pattern disposed on the side surface of the substrate and connected to the printed wiring circuit;
• a second conductive pattern disposed on the side surface of the substrate and connected to the printed wiring circuit, the second conductive pattern being spaced from the first conductive pattern;
• an elastically flexible insulating member disposed in spaced relation from the substrate;
• a conducting element fixedly attached to the insulating member in facing and spaced apart relationship to the first and second conductive patterns;
• and an operating member mounted on the side surface of the case and operable when depressed to elastically flex the insulating member to thereby displace the conducting element into contact with the first and second conductive patterns on the side surface of the substrate.