Miniaturized electronic device in particular with a gyromagnetic effect

An electronic device with a gyromagnetic effect, such as a circulator or isolator, having a multilayer structure, comprising

• a lower substrate and an upper substrate situated in a superimposed arrangement, at least one of said lower substrate and said upper substrate being made from ferrite,
• a layer of dielectric material situated between said lower and upper substrates, said dielectric layer being a serigraphiable dielectric material layer deposited as a thick layer between said lower and upper substrates,
• first and second patterns of metallic electrically conducting circuit elements supported by said dielectric thick layer and arranged in different planes within said dielectric thick layer distant from one another in the direction of the superposition of said arrangement,
• means for electrically connecting said first and second circuit patterns via throughholes traversing said dielectric material layer, said throughholes being seri-engraved as very small diameter metallized holes, and
• means for metallizing a respective surface of each of said upper and lower substrates which are opposite to surfaces between which said dielectric thick layer is placed, said metallizing means comprising holes for interconnecting the respective metal surface of said lower and upper substrates through said substrates and said dielectric thick layer.

An electronic device with a gyromagnetic effect, such as a three gate circulator each gate of which is connected to an access line of an external connection, and having a multilayer structure, comprising

• a lower substrate and an upper substrate situated in a superimposed arrangement, at least one of said lower substrate and said upper substrate being made from ferrite,
• a layer of dielectric material arranged between said lower and upper substrates, said dielectric layer being a serigraphiable dielectric material layer deposited as a thick layer between said lower and upper substrates,
• a first and a second pattern of metallic electrically conducting circuit elements supported by said dielectric material layer, said first and second circuit element patterns being located in different planes within said dielectric thick layer distant from one another in the direction of the superposition of said arrangement,
• means for electrically connecting said first and second circuit patterns via throughholes traversing said dielectric material layer, said throughholes being seri-engraved as very small diameter metallized holes, and
• means for metallizing a respective surface of each of said upper and lower substrates which are opposite to surfaces between which said dielectric thick layer is placed, said metallizing means comprising holes for interconnecting the respective metal surface of said lower and upper substrates through said substrates and said dielectric thick layer,
• said first and the second patterns each constituting one half of an arrangement of three inductances electrically isolated from each other, each of said inductances having two ends, one end being electrically connected to one of said holes of said metallization means and the other end being electrically connected to one of said three gates.