Molded semiconductor device

A molded semiconductor device comprising:

• a molded resin body having a mold area;
• a semiconductor chip sealed within said molded resin body;
• first metal member sealed within said molded resin body and serving as a ground conductor on which said semiconductor chip is mounted;
• a second metal member sealed within said molded resin body and serving as a central conductor which is connected to said semiconductor chip by wire bonding for electrically connecting said semiconductor chip to an external unit;
• said second metal member being sandwiched between two portions of said first metal member;
• said first metal member and said second metal member sealed within said molded resin body jointly forming a high-frequency input/output terminal as a first high-frequency transmission line having a first predetermined impedance;
• said second metal member being branched to form a plurality of metal members that extend outwardly from said mold area of said molded resin body so that the device can accommodate connectors of varying widths, said first metal member having portions extending outwardly from said mold area disposed one on each side of said plurality of metal members extending outwardly from said mold area;
• said portions of said first metal member and said plurality of metal members extending outwardly from said mold area jointly forming a second transmission line having a second predetermined impedance.