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AssigneeDigital Equipment Corporation
InventorsGary M. Freedman, Maurice P. Brodeur, Peter J. Elmgren
Estimating the term…
This disclosure relates to a process for laser soldering surface mount components on a printed circuit board using the continuous wave laser scanning technique. The process involves factoring together the scan rate, the beam diameter, and the laser power level, in order to determine what these specific process variables should be. In addition, the process also involves taking account of the depth of a metallic layer, such as a reference plane, inside the printed circuit board to determine its effect on other process variables. On the other hand, if the board does not have a metallic layer, the process takes account of the thickness of the board being processed. Preferred ranges for process variables are identified, as well as optimization techniques which further refine the process variables to achieve production efficiency or bonding pull strength.
A method of laser bonding comprising the steps of:
A method of laser bonding a first conductive element and a second conductive element disposed in contact with said first conductive element and on a mounting surface of a substrate, said substrate comprising a conductive plane and a dielectric layer disposed between said conductive plane and said mounting surface, said method comprising the steps of:
A method of laser bonding a first conductive element and a second conductive element disposed in contact with said first conductive element and on a mounting surface of a substrate having a thickness (T), comprising the steps of:
A method of laser bonding a first conductive element and a second conductive element disposed in contact with said first conductive element and on a mounting surface of a substrate, said substrate comprising a conductive plane and a dielectric layer disposed between said conductive plane and said mounting surface, said method comprising the steps of:
Dependencies are inferred from the claim text.