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US 5,494,950 AGranted
Epoxy resin composition containing alkylated hydroquinone epoxide
AssigneeTotokasei Co., Ltd.
InventorsHideyasu Asakage, Michio Aritomi, Xiao Li Wu
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Abstract
An epoxy resin composition comprising an epoxy resin component containing at least 5% by weight of an epoxy resin of Formula [I], an epoxy hardener, and an inorganic filler as essential constituents: ##STR1## [wherein R and R.sup.1 denote alkyl of C.sub.2 to C.sub.6, and n is an integer repetition unit from 0 to 10] The epoxy resin composition, when used as a molding material, is low in water absorption rate and flexural modulus (low stress).
Claims4
An epoxy resin composition for encapsulating electronic parts comprising:
- 26 to 5 parts by weight of an epoxy resin component containing at least 5% by weight of an epoxy resin of the formula ##STR3## wherein R and R.sup.1 denote tert-butyl, and
- n has an average value of from 0 to 10, said epoxy resin of said formula having a crystalline melting point of 50.degree. to 150.degree. C. and a melt viscosity at 150.degree. C. of 0.1 poise or less;
- 14to 2 parts by weight of an epoxy hardener;
- and
- 60 to 93 parts by weight of an inorganic filler;
- said epoxy resin composition totalling 100 parts by weight.
3 more elements
Dependencies are inferred from the claim text.