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AssigneeInternational Business Machines Corporation
InventorsGuy D. Beaumont, Denis Labbe, Alain Warren
Estimating the term…
A method is provided for creating solder connections between two surfaces which connections are relatively weak and thus can be readily fractured for separating the surfaces. The preferred application of the disclosed process is its use in connecting semiconductor chips to a carrier in order to conduct burn-in tests on the chips. The process consists of a series of steps to form a surface having a matrix of solder wettable and solder non-wettable areas on the pads of the carrier. Once the solder balls on the chip are attached to the treated pads on the carrier, electrical contacts are made and the chip can be readily removed after the test. The uniquely configured carrier can then be reused numerous times for testing or burning-in chips.
A process for creating a temporary and detachable connection between one surface which is partially non-wettable by solder and a second surface having a source of solder, comprising the steps of:
A process for creating a temporary and detachable connection between one surface which is partially non-wettable by solder and a second surface having a source of solder, comprising the steps of:
A process for creating detachable electrical connections between solder balls of a semiconductor chip and connecting pads of a carrier wherein the pads consist of a material which is solder non-wettable, by forming areas on the pads which consist of a matrix of solder wettable and solder non-wettable materials such that the chip can be readily removed from the carrier with minimal damage to the chip and carrier, comprising the steps of:
Dependencies are inferred from the claim text.