Method for making printed circuit boards

Abstract

Disclosed is a method for making a printed circuit board which comprises providing a photoconductive layer by electrodeposition method on a metal conductive layer provided on at least one side of an electrically insulating substrate, forming a toner image on said photoconductive layer by electrophotographic process, then dissolving and removing the area of the photoconductive layer not covered by the toner using a printer and optionally etching the surface of the area of the substrate from which the photoconductive layer has been removed. According to this method, by employing especially the electrophotographic reversal development, a printed circuit board of excellent sensitivity and high resolution can be produced even from both-side copper-clad laminate sheets having through-holes of a high aspect ratio using an exposure source of low energy such as semiconductor laser.

Dependencies are inferred from the claim text.