Passive intermodulation products (PIM) free tape
AssigneeLockheed Missiles & Space Company, Inc.
InventorThomas E. McCloskey
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AssigneeLockheed Missiles & Space Company, Inc.
InventorThomas E. McCloskey
Estimating the term…
The present invention relates to a tape for seaming together RF shielding thermal blankets of the kind used for covering the metal components of high power RF transmit and receive communications systems which are susceptible to generating passive intermodulation products, such as the high power transmit antenna boom assemblies of communications spacecraft. The tape is constructed as a composite lay-up of materials which preferably include a plastic film top or outboard layer, a metallized plastic film or metal foil middle layer, and a transfer adhesive bottom layer for securing the middle layer to the outboard layer. The transfer adhesive functions both as a substrate attaching medium and as an electrical isolator for encapsulating the metal surfaces of the middle layer. The tape, when applied to cover a seam between adjacent RF shielding thermal blankets, prevents RF energy from penetrating the seam and contacting any metal-to-metal junctions underneath which could result in the generation of undesirable passive intermodulation products or "PIM".
An electrically non-conductive and RF shielding tape for seaming together and for repairing holes or damaged portions of RF shielding thermal blankets of the kind used for covering metal components of communications spacecraft, said tape having a construction for preventing RF energy from penetrating the seams, holes or damaged portions of the RF shielding thermal blankets which, in the presence of certain metal-to-metal junctions or shapes, can produce undesirable passive intermodulation products (PIM), said tape comprising:
Dependencies are inferred from the claim text.