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US 5,494,712 AGranted
Method of forming a plasma polymerized film
AssigneeThe Dow Chemical Company
InventorsIng-Feng Hu, James C. Tou
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Abstract
A method of preparing a coated substrate is disclosed. The substrate is coated with a plasma generated polymer containing Si, O, C and H in specific atom ratio wherein the polymer also contains certain functional groups. A power density of about 10.sup.6 to about 10.sup.8 J/Kg is employed in the plasma polymerization process.
Claims5
A method of forming a plasma polymerized organosilicone film on a surface of a substrate which comprises:
- a) providing the substrate within a a reaction zone of a reaction vessel,
- b) providing a vacuum within said reaction vessel ranging from about 10.sup.-3 to about 1 Torr,
- c) forming a plasma of reaction gases from organosilicone monomer and excess oxygen while flowing said reaction gases essentially perpendicular to the surface of said substrate, and
- d) intensifying the plasma by magnetic confinement of at least 100 gauss to form a concentrated reaction plasma said magnetic confinement being positioned within said reaction zone at a point adjacent to and extending into said concentrated reaction plasma and,
- e) continuing said film formation to a thickness of about 2 to about 8 microns.
2 more elements
Dependencies are inferred from the claim text.