Dicing method

Abstract

In a dicing method, a resin adhesive tape is stuck to one surface of a wafer mount frame, then a rubber plate is stuck to the tape from the open side of the frame. With the rubber plate stretched, an adhesive is sprayed over the rubber plate, whereupon a wafer is stuck to the rubber plate. A weight is placed on the rubber plate to extend it further, thus fixing the wafer to the frame. The thus mounted wafer is diced. Alternatively, a resin adhesive tape is stuck to one surface of the frame, then a thick adhesive rubber plate is stuck to the tape from the open side of the frame, whereupon a wafer with hard wax printed using a screen mask is stuck to the rubber plate. The thus mounted wafer is diced by cutting into it deeply. The cut wafer is soaked in a solvent for separation from the rubber plate. As a further alternative, screen mask printing is carried out on a wafer, and wax is coated over the wafer. A resin adhesive tape is stuck to one surface of a wafer mount frame, and then a thick adhesive rubber plate is stuck to the tape from the open side of the wafer mount frame, whereupon the wax-side surface of the wafer is stuck to the rubber plate. The mounted wafer is diced. The wafer is soaked in a solvent for separation of chips from the rubber plate.

Dependencies are inferred from the claim text.