Method of providing VLSI-quality crystalline semiconductor substrates

Abstract

A method is described which makes it possible to use VLSI-quality crystalline semiconductor substrates for the fabrication of the active devices of Active Matrix Flat Panels (AMFPD). The VLSI substrates are provided by arranging a layer of light transparent material in those areas of a semiconductor wafer in which no active device has to be provided, eliminating the semiconductor wafer whereby a transparent wafer is obtained with crystalline semiconductor regions therein and then shaping the transparent wafer into a sized module unit. Several module units can be bonded to a glass substrate and a conductive material is then deposited to make electrical interconnections between the module units. The bonding operation can be performed either at room temperature using a light-transparent glue or at higher temperature using a wafer bonding technique known in the art of Silicon-On-Insulator technology.

Dependencies are inferred from the claim text.