Three-terminal noise filter having M-shaped lead
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJong M. Park
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Abstract
The invention discloses a 3-terminal noise filter for preventing electro-magnetic interferences, and a process for manufacturing thereof. A lead wire is bent into an M shaped structure, with a depressed portion being formed on the upper portion of the M shape structure. A separate lead is disposed as a capacitor lead, and the bottom of the depressed portion and the leading end of the capacitor lead are pressed into first and second flat portions. Then a capacitor is soldered on the first and second flat portions. The man-hours for the manufacturing of the filter are reduced, and the mechanical and electrical characteristics are stabilized, and the manufacturing cost is saved by the use of low cost materials.
Claims4
A 3-terminal noise filter comprising:
- a single wire having an M shaped structure, said M shaped structure defining first and second inductor lead wires and a depressed portion therebetween;
- a capacitor lead wire disposed between said first and second lead wires and in parallel therewith;
- first and second flat portions disposed on a bottom of the depressed portion of the M shaped structure and on a leading end of said capacitor lead wire, respectively;
- a chip capacitor having first and second electrodes connected to said first and second flat portions, respectively;
- and
- first and second ferrite beads concentrically fitted to said first and second inductor lead wires, respectively,
- wherein said 3-terminal noise filter further includes a respective step disposed on said first and second flat portions, wherein each said step is offset from a longitudinal axis of said capacitor lead wire and wherein said 3-terminal noise filter further includes unpressed portions located on opposed sides of said first flat portion defining a seating area on said first flat portion for said chip capacitor.
A process for manufacturing a 3-terminal noise filter, comprising the steps of:
- forming an upper depressed portion and first and second inductor leads by bending a single lead wire into an M shaped structure;
- inserting said first and second inductor leads into first and second ferrite beads, respectively, positioning a capacitor lead between said first and second inductor leads in parallel therewith and securing all of said leads upon a base paper by means of a piece of tape;
- pressing a bottom of said depressed portion and a leading end of said capacitor lead into first and second flat portions, respectively;
- soldering first and second electrodes of a chip capacitor onto said first and second flat portions, respectively, and pushing said first and second ferrite beads to an upper portion of said first and second inductor leads, respectively;
- and
- encapsulating said first and second ferrite beads and said chip capacitor with an insulating resin material.
Dependencies are inferred from the claim text.