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AssigneeInternational Business Machines Corporation
InventorsJames M. Levite, Michael Berger, Richard L. Chartrand, Mary A. Emmett, Raymond A. Jackson, James J. Petrone, Richard F. Shortt, Roger A. Stinemire
Estimating the term…
The present invention relates generally to a new structure and a method for repairing semiconductor substrates, and more particularly, the invention encompasses a structure and a method for repairing Printed Circuit Boards or other electronic substrates by providing electrical lines on the defective board. On a substrate that has an open or an electrical discontinuity, after the discontinuity has been established, a portion of the electrical line across from the electrical discontinuity are exposed and one or more trenches or grooves are made between the two or more exposed portions of the electrical line. The two exposed portions of the exposed electrical line is then joined by either an electrical wire that is routed through the trench or using a standard deposition process one or more metals or material are deposited in the open trench to provide or restore electrical continuity and the excess deposition material is removed. This invention also provides means for impedance matching of the net that is repaired.
A repaired structure comprising a carrier having at least one electrical line having a discontinuity and forming at least one first segment and at least one second segment, at least a portion of said first segment and at least a portion of said second segment are exposed, at least one trench in said carrier between the exposed sections of said first segment and said second segment, an electrical connection having a first end and a second end routed through said trench and wherein said first end is secured to at least a portion of said exposed first segment and wherein said second end is secured to at least a portion of said exposed second segment to provide electrical continuity to said defective electrical line and thereby providing said repaired structure.
Dependencies are inferred from the claim text.