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US 5,492,980 AGranted
Thermoplastic molding resin composition
AssigneeKishimoto Sangyo Co., Ltd.
InventorTakeshi Moriwaki
Life of this patent
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Abstract
Thermoplastic molding resin composition comprising 70-95 weight % of aliphatic polyamide, 5-30 weight % of phenolic resin, and 0-20 % of semi-aromatic amorphous polyamide, and further high density polyamide composition comprising 100 parts by weight of the mixture of 60-95 parts by weight of aliphatic crystalline polyamide, 5-30 parts by weight of phenolic resin, and 200-1000 parts by weight of metal powder or metal oxide powder or inorganic filler having specific gravity of more than 2.6.
Claims5
A thermoplastic molding resin composition comprising:
- 70-95% by weight of the total composition of a polyamide selected from the group consisting of Nylon 6 and Nylon 66;
- and
- 5-30% by weight of the total composition of a novolak prepolymer consisting of a condensation product of phenol and formaldehyde.
Dependencies are inferred from the claim text.